Finding Why Solder Joints Failed, Not Just Which Ones
AI-based X-ray image analysis identified improper soldering on PCBs and traced the process conditions behind recurring quality problems.
ITChamps implemented an AI-enabled X-ray image analysis and quality intelligence solution for an ESDM manufacturer, identifying improper soldering and other PCB defects and tracing their probable causes.
The Challenge
Detecting bad PCBs was easy; explaining why they were bad was not
Conventional inspection methods could identify poor-quality products, but identifying the underlying reasons for recurring quality problems was more challenging, limiting the ability to improve the process itself.
- Improper soldering and other PCB quality issues recurred during manufacturing.
- Conventional inspection could flag defective units but not explain recurring causes.
- The team needed insight into causes of poor quality, not just detection.
- The goal was better process control, not just more inspection.
The Solution
X-ray defect detection linked back to process conditions
The solution analyzed X-ray images of manufactured PCBs with AI to detect defects, then combined quality-pattern analysis with process data to identify probable root causes and feed insights back into the process.
Collected X-ray images of manufactured PCBs for analysis.
Analyzed X-ray images with AI to identify improper soldering and other quality deviations.
Differentiated good and poor-quality products based on identified characteristics.
Analyzed historical quality and process data to identify recurring patterns.
Identified probable reasons contributing to poor-quality output.
Fed insights back into the manufacturing process to support corrective and preventive action.
Results
Measured business impact
Reduction in bad-quality-related losses.
Automated identification of improper soldering and other deviations.
Insights fed back into the process to support corrective action.
Shift from defect detection toward defect prevention.
Highlights
- Went beyond identifying poor-quality PCBs to explaining why they occurred.
- Enabled corrective action at the process level, not just the inspection line.
- Shifted the organization from defect detection toward defect prevention.
- Improved manufacturing control through process-level feedback.
Services and technology
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